Key MIPI Specifications
MIPI Alliance members develop the world’s most comprehensive set of interface specifications for mobile and mobile-influenced products. Here are a few of our major specifications.
CSI-2®
MIPI Camera Serial Interface 2
A widely adopted, high-speed protocol for transmission of still and video images from image sensors to application processors
DSI-2™
MIPI Display Serial Interface 2
A forward-looking, scalable high-speed interface that specifies the high-bandwidth link between host processors and displays
I3C®
MIPI Improved Inter Integrated Circuit
A scalable utility and control bus interface for connecting peripherals to an application processor
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C-PHY™
Physical Layer
A physical layer for high-performance, cost-optimized cameras and displays
D-PHY™
Physical Layer
A physical layer for high-performance, cost-optimized cameras and displays
A-PHY®
Physical Layer
Long-reach SerDes physical layer specification advancing ADAS, ADS, IVI and other automotive applications
SoundWire®
Audio Interface
A comprehensive, unified interface for small audio peripherals
RFFE™
MIPI RF Front-End Control Interface
A control interface that simplifies integration of complex RF front-end devices
News & Events
PAL™/ DSI‑2 v1.1
June 2025
PAL™/ eDP‑DP v1.1
June 2025
I3C Basic™ v1.2
April 2025
C-PHY™ v3.0
March 2025
I3C® v1.2
February 2025
Elektor Webinar: How To Get Started with the MIPI I3C® Interface
30 October 2025
8-9 a.m. (PDT) | 4-5 p.m. (CET)























